CPC Main Group Additional Only
H01H 2229/00 Manufacturing
27 direct subcodes
Child Classifications
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- H01H 2229/002 Screen printing
- H01H 2229/006 Pad transfer printing
- H01H 2229/008 Die stamping
- H01H 2229/01 Foil transfer process
- H01H 2229/012 Vacuum deposition
- H01H 2229/014 Electro deposition
- H01H 2229/016 Selective etching
- H01H 2229/018 Testing
- H01H 2229/02 Laser
- H01H 2229/022 Modular assembly
- H01H 2229/024 Packing between substrate and membrane
- H01H 2229/034 Positioning of layers
- H01H 2229/036 ultrasonic
- H01H 2229/038 Folding of flexible printed circuit
- H01H 2229/04 Solder problems
- H01H 2229/042 Snap coupling; Snap mounting
- H01H 2229/044 Injection moulding
- H01H 2229/05 Forming; Half-punching
- H01H 2229/052 Thermoplastic bonding foil
- H01H 2229/054 CAD