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DIFF Subgroup
H10H 20/857

Interconnections, e.g. lead-frames, bond wires or solder balls

Introduced: January 2025

Full Title

Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED] > Constructional details > Packages > Interconnections, e.g. lead-frames, bond wires or solder balls

No child classifications to compare. This is a leaf node in both IPC and CPC.