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CPC Subgroup
B22C 1/02

characterised by additives for special purposes, e.g. indicators, breakdown additives

Full Title

Compositions of refractory mould or core materials; Grain structures thereof (refractory materials in general C04B35/00); Chemical or physical features in the formation or manufacture of moulds > characterised by additives for special purposes, e.g. indicators, breakdown additives

Filing statistics

CPC B22C 1/02 belongs to the parent subclass B22C, which recorded 29,163 patent applications worldwide between 2013 and 2023. Annual filings grew from 1,545 in 2013 to 2,127 in 2023 (+38%), peaking at 3,597 applications in 2018. The most active applicants in class B22 are GE (GENERAL ELECTRIC COMPANY) (2,157 applications), HEWLETT-PACKARD DEVELOPMENT COMPANY (1,633 applications) and SIEMENS (1,267 applications).

Source: EPO PATSTAT, worldwide filings

5 direct subcodes

Child Classifications

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  • B22C 1/08 for decreasing shrinkage of the mould, e.g. for investment casting
  • B22C 1/10 for influencing the hardening tendency of the mould material (influencing the hardening tendency of the binding agent only B22C1/16)
  • B22C 1/12 for manufacturing permanent moulds or cores
  • B22C 1/14 for separating the pattern from the mould

Top Applicants

Top 10 applicants by patent filingsfor class B22, 2013–2023, worldwide · Source: EPO PATSTAT

  1. GE (GENERAL ELECTRIC COMPANY) US 2,157
  2. HEWLETT-PACKARD DEVELOPMENT COMPANY US 1,633
  3. SIEMENS DE 1,267
  4. POSCO (POHANG IRON AND STEEL COMPANY) KR 1,124
  5. CHINESE ACADEMY OF SCIENCES 1,040
  6. UNITED TECHNOLOGIES CORPORATION (UTC) US 1,015
  7. JFE STEEL JP 884
  8. CENTRAL SOUTH UNIVERSITY 810
  9. HITACHI METALS JP 641
  10. SINTOKOGIO JP 624