CPC Subgroup
B22C 11/12 Moulding machines able to travel
Full Title
Moulding machines characterised by the relative arrangement of the parts of same > Moulding machines able to travel
Top Applicants
Top 10 applicants by patent filingsfor class B22, 2013–2023, worldwide · Source: EPO PATSTAT
- GE (GENERAL ELECTRIC COMPANY) US 2,157
- HEWLETT-PACKARD DEVELOPMENT COMPANY US 1,633
- SIEMENS DE 1,267
- POSCO (POHANG IRON AND STEEL COMPANY) KR 1,124
- CHINESE ACADEMY OF SCIENCES 1,040
- UNITED TECHNOLOGIES CORPORATION (UTC) US 1,015
- JFE STEEL JP 884
- CENTRAL SOUTH UNIVERSITY 810
- HITACHI METALS JP 641
- SINTOKOGIO JP 624