CPC Subgroup
B22C 13/085 Full Title
Moulding machines for making moulds or cores of particular shapes > for shell moulds or shell cores
Filing statistics
CPC B22C 13/085 belongs to the parent subclass B22C, which recorded 29,163 patent applications worldwide between 2013 and 2023. Annual filings grew from 1,545 in 2013 to 2,127 in 2023 (+38%), peaking at 3,597 applications in 2018. The most active applicants in class B22 are GE (GENERAL ELECTRIC COMPANY) (2,157 applications), HEWLETT-PACKARD DEVELOPMENT COMPANY (1,633 applications) and SIEMENS (1,267 applications).
Source: EPO PATSTAT, worldwide filings
Top Applicants
Top 10 applicants by patent filingsfor class B22, 2013–2023, worldwide · Source: EPO PATSTAT
- GE (GENERAL ELECTRIC COMPANY) US 2,157
- HEWLETT-PACKARD DEVELOPMENT COMPANY US 1,633
- SIEMENS DE 1,267
- POSCO (POHANG IRON AND STEEL COMPANY) KR 1,124
- CHINESE ACADEMY OF SCIENCES 1,040
- UNITED TECHNOLOGIES CORPORATION (UTC) US 1,015
- JFE STEEL JP 884
- CENTRAL SOUTH UNIVERSITY 810
- HITACHI METALS JP 641
- SINTOKOGIO JP 624