CPC Subgroup
B22F 10/20 Direct sintering or melting
Full Title
Additive manufacturing of workpieces or articles from metallic powder (apparatus or devices therefor B22F12/00) > Direct sintering or melting
3 direct subcodes
Child Classifications
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- B22F 10/22 Direct deposition of molten metal
- B22F 10/25 Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS]
- B22F 10/28 Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
Top Applicants
Top 10 applicants by patent filingsfor class B22, 2013–2023, worldwide · Source: EPO PATSTAT
- GE (GENERAL ELECTRIC COMPANY) US 2,157
- HEWLETT-PACKARD DEVELOPMENT COMPANY US 1,633
- SIEMENS DE 1,267
- POSCO (POHANG IRON AND STEEL COMPANY) KR 1,124
- CHINESE ACADEMY OF SCIENCES 1,040
- UNITED TECHNOLOGIES CORPORATION (UTC) US 1,015
- JFE STEEL JP 884
- CENTRAL SOUTH UNIVERSITY 810
- HITACHI METALS JP 641
- SINTOKOGIO JP 624