CPC Main Group Additional Only
B22F 2302/00 Metal Compound, non-Metallic compound or non-metal composition of the powder or its coating
10 direct subcodes
Child Classifications
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- B22F 2302/05 Boride
- B22F 2302/10 Carbide
- B22F 2302/15 Carbonitride
- B22F 2302/20 Nitride
- B22F 2302/205 Cubic boron nitride
- B22F 2302/25 Oxide
- B22F 2302/30 Oxynitride
- B22F 2302/35 Complex boride, carbide, carbonitride, nitride, oxide or oxynitride
- B22F 2302/40 Carbon, graphite
- B22F 2302/45 Others, including non-metals
Top Applicants
Top 10 applicants by patent filingsfor class B22, 2013–2023, worldwide · Source: EPO PATSTAT
- GE (GENERAL ELECTRIC COMPANY) US 2,157
- HEWLETT-PACKARD DEVELOPMENT COMPANY US 1,633
- SIEMENS DE 1,267
- POSCO (POHANG IRON AND STEEL COMPANY) KR 1,124
- CHINESE ACADEMY OF SCIENCES 1,040
- UNITED TECHNOLOGIES CORPORATION (UTC) US 1,015
- JFE STEEL JP 884
- CENTRAL SOUTH UNIVERSITY 810
- HITACHI METALS JP 641
- SINTOKOGIO JP 624