Working by laser beam, e.g. welding, cutting or boring

Child Classifications

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• B23K 26/0006
• B23K 26/009
• B23K 26/0093
• B23K 26/0096
• B23K 26/02 Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
• B23K 26/08 Devices involving relative movement between laser beam and workpiece
• B23K 26/12 in a special environment or atmosphere, e.g. in an enclosure
• B23K 26/14 using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor (B23K26/12 takes precedence)
• B23K 26/16 Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece (by a fluid stream B23K26/142)
• B23K 26/18 using absorbing layers on the workpiece, e.g. for marking or protecting purposes
• B23K 26/20 Bonding (soldering by means of radiant energy B23K1/005)
• B23K 26/34 Laser welding for purposes other than joining
• B23K 26/346 in combination with welding or cutting covered by groups B23K5/00 - B23K25/00, e.g. in combination with resistance welding
• B23K 26/351 for trimming or tuning of electrical components
• B23K 26/352 for surface treatment
• B23K 26/36 Removing material (B23K26/55, B23K26/57 take precedence)
• B23K 26/50 Working by transmitting the laser beam through or within the workpiece
• B23K 26/60 Preliminary treatment
• B23K 26/70 Auxiliary operations or equipment