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CPC Subgroup
B23K 33/008

Full Title

Specially-profiled edge portions of workpieces for making soldering or welding connections; Filling the seams formed thereby

Top Applicants

Top 10 applicants by patent filingsfor class B23, 2013–2023, worldwide · Source: EPO PATSTAT

  1. ITW (ILLINOIS TOOL WORKS) US 3,642
  2. DISCO CORPORATION JP 3,316
  3. FANUC JP 3,111
  4. ROBERT BOSCH DE 2,711
  5. FANUC 2,163
  6. GE (GENERAL ELECTRIC COMPANY) US 2,113
  7. ISCAR IL 1,516
  8. SIEMENS DE 1,459
  9. LINCOLN GLOBAL US 1,433
  10. KOBE STEEL JP 1,423