CPC Main Group
B26D 3/00 Cutting work characterised by the nature of the cut made; Apparatus therefor
Filing statistics
CPC B26D 3/00 belongs to the parent subclass B26D, which recorded 69,864 patent applications worldwide between 2013 and 2023. Annual filings grew from 2,856 in 2013 to 6,279 in 2023 (+120%), peaking at 10,139 applications in 2020. The most active applicants in class B26 are GILLETTE COMPANY (1,745 applications), PHILIPS ELECTRONICS (1,410 applications) and BIC-VIOLEX (638 applications).
Source: EPO PATSTAT, worldwide filings
14 direct subcodes
Child Classifications
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- B26D 3/02 Bevelling
- B26D 3/06 Grooving involving removal of material from the surface of the work
- B26D 3/08 Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
- B26D 3/10 Making cuts of other than simple rectilinear form (cutting-out B26F)
- B26D 3/12 Slitting marginal portions of the work, i.e. forming cuts, without removal of material, at an angle, e.g. a right angle, to the edge of the work
- B26D 3/14 Forming notches in marginal portion of work by cutting (by punching B26F1/12)
- B26D 3/16 Cutting rods or tubes transversely
- B26D 3/18 to obtain cubes or the like (ice harvesting F25C5/02)
- B26D 3/24 to obtain segments other than slices, e.g. cutting pies
- B26D 3/28 Splitting layers from work; Mutually separating layers by cutting (B26D3/30 takes precedence; Recovery of plastics or other constituents of waste material containing plastics B29B17/00)
- B26D 3/30 Halving devices, e.g. for halving buns
Top Applicants
Top 10 applicants by patent filingsfor class B26, 2013–2023, worldwide · Source: EPO PATSTAT
- GILLETTE COMPANY US 1,745
- PHILIPS ELECTRONICS NL 1,410
- BIC-VIOLEX GR 638
- PHILIPS ELECTRONICS 378
- DISCO CORPORATION JP 355
- BRAUN DE 325
- WEBER MASCHINENBAUBREIDENBACH DE 304
- DORCO COMPANY KR 297
- GILLETTE COMPANY 290
- URSCHEL LABORATORIES US 264