CPC Subgroup Additional Only
B32B 2037/1253 Full Title
Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding > characterised by using adhesives
1 direct subcode
Child Classifications
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Top Applicants
Top 10 applicants by patent filingsfor class B32, 2013–2023, worldwide · Source: EPO PATSTAT
- NITTO DENKO CORPORATION JP 5,666
- SAINT-GOBAIN GLASS FR 4,491
- 3M INNOVATIVE PROPERTIES COMPANY (MINNESOTA MINING AND MANUFACTURING INNOVATIVE PROPERTIES COMPANY) US 3,703
- DOW GLOBAL TECHNOLOGIES US 3,403
- NITTO DENKO CORPORATION 3,009
- FUJIFILM JP 2,629
- CORNING US 2,623
- LG CHEM KR 2,576
- SEKISUI CHEMICAL COMPANY JP 2,482
- TORAY INDUSTRIES JP 2,189