CPC Subgroup Additional Only
B32B 2037/268 Full Title
Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding > characterised by the properties of the layers > with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
Top Applicants
Top 10 applicants by patent filingsfor class B32, 2013–2023, worldwide · Source: EPO PATSTAT
- NITTO DENKO CORPORATION JP 5,666
- SAINT-GOBAIN GLASS FR 4,491
- 3M INNOVATIVE PROPERTIES COMPANY (MINNESOTA MINING AND MANUFACTURING INNOVATIVE PROPERTIES COMPANY) US 3,703
- DOW GLOBAL TECHNOLOGIES US 3,403
- NITTO DENKO CORPORATION 3,009
- FUJIFILM JP 2,629
- CORNING US 2,623
- LG CHEM KR 2,576
- SEKISUI CHEMICAL COMPANY JP 2,482
- TORAY INDUSTRIES JP 2,189