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CPC Subgroup
B32B 37/182

Full Title

Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding > characterised by the properties of the layers > with all layers existing as coherent layers before laminating > involving the assembly of discrete sheets or panels only

1 direct subcode

Child Classifications

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Top Applicants

Top 10 applicants by patent filingsfor class B32, 2013–2023, worldwide · Source: EPO PATSTAT

  1. NITTO DENKO CORPORATION JP 5,666
  2. SAINT-GOBAIN GLASS FR 4,491
  3. 3M INNOVATIVE PROPERTIES COMPANY (MINNESOTA MINING AND MANUFACTURING INNOVATIVE PROPERTIES COMPANY) US 3,703
  4. DOW GLOBAL TECHNOLOGIES US 3,403
  5. NITTO DENKO CORPORATION 3,009
  6. FUJIFILM JP 2,629
  7. CORNING US 2,623
  8. LG CHEM KR 2,576
  9. SEKISUI CHEMICAL COMPANY JP 2,482
  10. TORAY INDUSTRIES JP 2,189