CPC Subgroup Additional Only
B41J 2202/30 Embodiments of or processes related to thermal heads
Full Title
Embodiments of or processes related to ink-jet or thermal heads > Embodiments of or processes related to thermal heads
8 direct subcodes
Child Classifications
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- B41J 2202/31 Thermal printer with head or platen movable
- B41J 2202/32 Thermal head for perforating stencil
- B41J 2202/33 Thermal printer with pre-coating or post-coating ribbon system
- B41J 2202/34 Thermal printer with pre-coating or post-processing
- B41J 2202/35 Thermal printing on id card
- B41J 2202/36 Thermal printing on disk-shaped medium
- B41J 2202/37 Writing and erasing thermal head
- B41J 2202/38 Test pattern thermal printing
Top Applicants
Top 10 applicants by patent filingsfor class B41, 2013–2023, worldwide · Source: EPO PATSTAT
- SEIKO EPSON CORPORATION 8,446
- SEIKO EPSON CORPORATION JP 8,438
- HEWLETT-PACKARD DEVELOPMENT COMPANY US 7,828
- CANON JP 5,419
- CANON 4,156
- BROTHER INDUSTRIES JP 3,763
- BROTHER INDUSTRIES 2,779
- RICOH COMPANY JP 2,717
- FUJIFILM JP 2,423
- RICOH COMPANY 1,739