CPC Subgroup Additional Only
C04B 2237/09 wherein the active component for bonding is not the largest fraction of the interlayer
Full Title
Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating > Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating > Ceramic interlayers > wherein the active component for bonding is not the largest fraction of the interlayer
1 direct subcode
Child Classifications
Navigate with arrow keys, Enter to open
- C04B 2237/095 The active component for bonding being silicon
Top Applicants
Top 10 applicants by patent filingsfor class C04, 2013–2023, worldwide · Source: EPO PATSTAT
- HALLIBURTON ENERGY SERVICES GROUP US 2,158
- CHINESE ACADEMY OF SCIENCES 1,569
- NGK INSULATORS JP 1,504
- SIKA TECHNOLOGY CH 1,181
- CORNING US 974
- WUHAN UNIVERSITY OF TECHNOLOGY 926
- UNITED STATES GYPSUM COMPANY US 882
- GE (GENERAL ELECTRIC COMPANY) US 828
- MITSUBISHI MATERIALS CORPORATION JP 792
- SAUDI ARABIAN OIL COMPANY SA 686