CPC Subgroup Additional Only
C04B 2237/124 based on copper
Full Title
Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating > Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating > Metallic interlayers > based on copper
Top Applicants
Top 10 applicants by patent filingsfor class C04, 2013–2023, worldwide · Source: EPO PATSTAT
- HALLIBURTON ENERGY SERVICES GROUP US 2,158
- CHINESE ACADEMY OF SCIENCES 1,569
- NGK INSULATORS JP 1,504
- SIKA TECHNOLOGY CH 1,181
- CORNING US 974
- WUHAN UNIVERSITY OF TECHNOLOGY 926
- UNITED STATES GYPSUM COMPANY US 882
- GE (GENERAL ELECTRIC COMPANY) US 828
- MITSUBISHI MATERIALS CORPORATION JP 792
- SAUDI ARABIAN OIL COMPANY SA 686