CPC Subgroup Additional Only
C04B 2237/50 Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
Full Title
Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating > Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
22 direct subcodes
Child Classifications
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- C04B 2237/52 Pre-treatment of the joining surfaces, e.g. cleaning, machining
- C04B 2237/54 Oxidising the surface before joining
- C04B 2237/55 Pre-treatments of a coated or not coated substrate other than oxidation treatment in order to form an active joining layer
- C04B 2237/56 Using constraining layers before or during sintering
- C04B 2237/58 Forming a gradient in composition or in properties across the laminate or the joined articles
- C04B 2237/59 Aspects relating to the structure of the interlayer
- C04B 2237/60 Forming at the joining interface or in the joining layer specific reaction phases or zones, e.g. diffusion of reactive species from the interlayer to the substrate or from a substrate to the joining interface, carbide forming at the joining interface
- C04B 2237/61 Joining two substrates of which at least one is porous by infiltrating the porous substrate with a liquid, such as a molten metal, causing bonding of the two substrates, e.g. joining two porous carbon substrates by infiltrating with molten silicon
- C04B 2237/62 Forming laminates or joined articles comprising holes, channels or other types of openings
- C04B 2237/64 Forming laminates or joined articles comprising grooves or cuts
- C04B 2237/66 Forming laminates or joined articles showing high dimensional accuracy, e.g. indicated by the warpage
- C04B 2237/68 Forming laminates or joining articles wherein at least one substrate contains at least two different parts of macro-size, e.g. one ceramic substrate layer containing an embedded conductor or electrode
- C04B 2237/70 Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B 2237/72 Forming laminates or joined articles comprising at least two interlayers directly next to each other
- C04B 2237/74 Forming laminates or joined articles comprising at least two different interlayers separated by a substrate
- C04B 2237/76 Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc
- C04B 2237/78 Side-way connecting, e.g. connecting two plates through their sides
- C04B 2237/80 Joining the largest surface of one substrate with a smaller surface of the other substrate, e.g. butt joining or forming a T-joint
- C04B 2237/82 Two substrates not completely covering each other, e.g. two plates in a staggered position
- C04B 2237/84 Joining of a first substrate with a second substrate at least partially inside the first substrate, where the bonding area is at the inside of the first substrate, e.g. one tube inside another tube