CPC Subgroup Additional Only
C04B 2237/84 Joining of a first substrate with a second substrate at least partially inside the first substrate, where the bonding area is at the inside of the first substrate, e.g. one tube inside another tube
Full Title
Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating > Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating > Joining of a first substrate with a second substrate at least partially inside the first substrate, where the bonding area is at the inside of the first substrate, e.g. one tube inside another tube
Top Applicants
Top 10 applicants by patent filingsfor class C04, 2013–2023, worldwide · Source: EPO PATSTAT
- HALLIBURTON ENERGY SERVICES GROUP US 2,158
- CHINESE ACADEMY OF SCIENCES 1,569
- NGK INSULATORS JP 1,504
- SIKA TECHNOLOGY CH 1,181
- CORNING US 974
- WUHAN UNIVERSITY OF TECHNOLOGY 926
- UNITED STATES GYPSUM COMPANY US 882
- GE (GENERAL ELECTRIC COMPANY) US 828
- MITSUBISHI MATERIALS CORPORATION JP 792
- SAUDI ARABIAN OIL COMPANY SA 686