CPC Main Group Additional Only
C08K 2201/00 Specific properties of additives
15 direct subcodes
Child Classifications
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- C08K 2201/001 Conductive additives
- C08K 2201/002 Physical properties
- C08K 2201/007 Fragrance additive
- C08K 2201/008 Additives improving gas barrier properties
- C08K 2201/009 Additives being defined by their hardness
- C08K 2201/01 Magnetic additives
- C08K 2201/011 Nanostructured additives
- C08K 2201/012 Additives improving oxygen scavenging properties
- C08K 2201/013 Additives applied to the surface of polymers or polymer particles
- C08K 2201/014 Additives containing two or more different additives of the same subgroup in C08K
- C08K 2201/015 Additives for heat shrinkable compositions
- C08K 2201/016 Additives defined by their aspect ratio
- C08K 2201/017 Additives being an antistatic agent
- C08K 2201/018 Additives for biodegradable polymeric composition
- C08K 2201/019 the composition being defined by the absence of a certain additive
Top Applicants
Top 10 applicants by patent filingsfor class C08, 2013–2023, worldwide · Source: EPO PATSTAT
- LG CHEM KR 15,432
- DOW GLOBAL TECHNOLOGIES US 14,214
- BASF (BADISCHE ANILIN & SODA FABRIK) DE 11,155
- 3M INNOVATIVE PROPERTIES COMPANY (MINNESOTA MINING AND MANUFACTURING INNOVATIVE PROPERTIES COMPANY) US 6,455
- FUJIFILM JP 6,178
- CHINESE ACADEMY OF SCIENCES 5,569
- SHIN-ETSU CHEMICAL COMPANY JP 5,506
- SINOPEC (CHINA PETROCHEMICAL CORPORATION) 5,443
- TORAY INDUSTRIES JP 4,635
- NITTO DENKO CORPORATION JP 4,620