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CPC Subgroup
C09J 185/04

containing boron

Full Title

Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon; Adhesives based on derivatives of such polymers > containing boron

Top Applicants

Top 10 applicants by patent filingsfor class C09, 2013–2023, worldwide · Source: EPO PATSTAT

  1. LG CHEM KR 7,954
  2. HALLIBURTON ENERGY SERVICES GROUP US 6,584
  3. NITTO DENKO CORPORATION JP 6,500
  4. 3M INNOVATIVE PROPERTIES COMPANY (MINNESOTA MINING AND MANUFACTURING INNOVATIVE PROPERTIES COMPANY) US 6,490
  5. DOW GLOBAL TECHNOLOGIES US 6,324
  6. FUJIFILM JP 5,832
  7. MERCK PATENT DE 5,481
  8. BASF (BADISCHE ANILIN & SODA FABRIK) DE 5,147
  9. SAMSUNG DISPLAY KR 5,105
  10. NITTO DENKO CORPORATION 3,584