CPC Subgroup
D01D 11/02 Opening bundles to space the threads or filaments from one another
Full Title
Other features of manufacture > Opening bundles to space the threads or filaments from one another
Top Applicants
Top 10 applicants by patent filingsfor class D01, 2013–2023, worldwide · Source: EPO PATSTAT
- TORAY INDUSTRIES JP 1,268
- MASCHINENFABRIK RIETER CH 1,200
- NATIONAL DONG HWA UNIVERSITY 955
- LENZING AT 602
- P&G (PROCTER & GAMBLE COMPANY) US 594
- WUHAN TEXTILE UNIVERSITY 494
- TRUETZSCHLER & COMPANY DE 453
- KOLON INDUSTRIES KR 433
- OERLIKON TEXTILE & COMPANY DE 430
- CHINESE ACADEMY OF SCIENCES 412