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CPC Subgroup Additional Only
E04F 2201/0582

of fibres or chips, e.g. bonded with synthetic resins

Full Title

Joining sheets or plates or panels > Separate connectors or inserts, e.g. pegs, pins, keys or strips > Separate tongues; Interlocking keys, e.g. joining mouldings of circular, square or rectangular shape > depending on the use of specific materials > of fibres or chips, e.g. bonded with synthetic resins

Top Applicants

Top 10 applicants by patent filingsfor class E04, 2013–2023, worldwide · Source: EPO PATSTAT

  1. CHINA CONSTRUCTION EIGHTH ENGINEERING DIVISION 1,675
  2. CHINA MCC17 GROUP COMPANY 1,593
  3. ZHEJIANG YASHA DECORATION COMPANY 1,551
  4. SGCC(STATE GRID CORPORATION OF CHINA) 1,297
  5. GOLD MANTIS FINE DECORATION TECHNOLOGY (SUZHOU) COMPANY 1,212
  6. SHENYANG JIANZHU UNIVERSITY 926
  7. VAELINGE INNOVATION SE 901
  8. CHINA MCC5 GROUP CORPORATION 894
  9. VKR HOLDING DK 854
  10. SHANGHAI BAOYE GROUP CORPORATION 753