CPC Subgroup Additional Only
E04F 2201/0582 of fibres or chips, e.g. bonded with synthetic resins
Full Title
Joining sheets or plates or panels > Separate connectors or inserts, e.g. pegs, pins, keys or strips > Separate tongues; Interlocking keys, e.g. joining mouldings of circular, square or rectangular shape > depending on the use of specific materials > of fibres or chips, e.g. bonded with synthetic resins
Top Applicants
Top 10 applicants by patent filingsfor class E04, 2013–2023, worldwide · Source: EPO PATSTAT
- CHINA CONSTRUCTION EIGHTH ENGINEERING DIVISION 1,675
- CHINA MCC17 GROUP COMPANY 1,593
- ZHEJIANG YASHA DECORATION COMPANY 1,551
- SGCC(STATE GRID CORPORATION OF CHINA) 1,297
- GOLD MANTIS FINE DECORATION TECHNOLOGY (SUZHOU) COMPANY 1,212
- SHENYANG JIANZHU UNIVERSITY 926
- VAELINGE INNOVATION SE 901
- CHINA MCC5 GROUP CORPORATION 894
- VKR HOLDING DK 854
- SHANGHAI BAOYE GROUP CORPORATION 753