CPC Subgroup Additional Only
F23C 2203/10 using heat exchanger
Full Title
Flame cooling methods otherwise than by staging or recirculation > using heat exchanger
Top Applicants
Top 10 applicants by patent filingsfor class F23, 2013–2023, worldwide · Source: EPO PATSTAT
- GE (GENERAL ELECTRIC COMPANY) US 2,581
- UNITED TECHNOLOGIES CORPORATION (UTC) US 1,180
- SIEMENS DE 1,157
- GE (GENERAL ELECTRIC COMPANY) 994
- XIAN THERMAL POWER RESEARCH INSTITUTE COMPANY 769
- MITSUBISHI HEAVY INDUSTRIES JP 701
- MITSUBISHI HITACHI POWER SYSTEMS JP 695
- RAYTHEON TECHNOLOGIES CORPORATION US 587
- NINGBO FOTILE KITCHENWARE COMPANY 543
- GENERAL ELECTRIC TECHNOLOGY CH 490