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CPC Subgroup Additional Only
F25B 2341/068

Expansion valves combined with a sensor

Full Title

Details of ejectors not being used as compression device; Details of flow restrictors or expansion valves > Details of flow restrictors or expansion valves > Expansion valves combined with a sensor

Filing statistics

CPC F25B 2341/068 belongs to the parent subclass F25B, which recorded 121,123 patent applications worldwide between 2013 and 2023. Annual filings grew from 7,227 in 2013 to 10,966 in 2023 (+52%), peaking at 13,018 applications in 2018. The most active applicants in class F25 are LG ELECTRONICS (9,415 applications), HAIER SMART HOME (8,015 applications) and MITSUBISHI ELECTRIC CORPORATION (5,758 applications).

Source: EPO PATSTAT, worldwide filings

3 direct subcodes

Child Classifications

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  • F25B 2341/0681 the sensor is heated
  • F25B 2341/0682 the sensor contains sorbent materials
  • F25B 2341/0683 the sensor is disposed in the suction line and influenced by the temperature or the pressure of the suction gas

Top Applicants

Top 10 applicants by patent filingsfor class F25, 2013–2023, worldwide · Source: EPO PATSTAT

  1. LG ELECTRONICS KR 9,415
  2. HAIER SMART HOME 8,015
  3. MITSUBISHI ELECTRIC CORPORATION JP 5,758
  4. BSH (BOSCH UND SIEMENS HAUSGERAETE) DE 3,827
  5. MIDEA 3,769
  6. GREE ELECTRIC APPLIANCES 3,417
  7. HAIER SMART HOME CN 3,403
  8. SAMSUNG ELECTRONICS COMPANY KR 3,329
  9. DAIKIN INDUSTRIES JP 2,908
  10. HEFEI MIDEA REFRIGERATOR COMPANY 2,186