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CPC Subgroup
F25B 30/02

of the compression type

Full Title

Heat pumps (F25B1/00-F25B25/00, F25B29/00 take precedence) > of the compression type

Filing statistics

CPC F25B 30/02 belongs to the parent subclass F25B, which recorded 121,123 patent applications worldwide between 2013 and 2023. Annual filings grew from 7,227 in 2013 to 10,966 in 2023 (+52%), peaking at 13,018 applications in 2018. The most active applicants in class F25 are LG ELECTRONICS (9,415 applications), HAIER SMART HOME (8,015 applications) and MITSUBISHI ELECTRIC CORPORATION (5,758 applications).

Source: EPO PATSTAT, worldwide filings

Top Applicants

Top 10 applicants by patent filingsfor class F25, 2013–2023, worldwide · Source: EPO PATSTAT

  1. LG ELECTRONICS KR 9,415
  2. HAIER SMART HOME 8,015
  3. MITSUBISHI ELECTRIC CORPORATION JP 5,758
  4. BSH (BOSCH UND SIEMENS HAUSGERAETE) DE 3,827
  5. MIDEA 3,769
  6. GREE ELECTRIC APPLIANCES 3,417
  7. HAIER SMART HOME CN 3,403
  8. SAMSUNG ELECTRONICS COMPANY KR 3,329
  9. DAIKIN INDUSTRIES JP 2,908
  10. HEFEI MIDEA REFRIGERATOR COMPANY 2,186