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CPC Subgroup
G01K 5/64

Details of the compounds system

Full Title

Measuring temperature based on the expansion or contraction of a material (G01K9/00 takes precedence; giving other than momentary value of temperature G01K3/00) > the material being a solid > constrained so that expansion or contraction causes a deformation of the solid > the solid body being formed of compounded strips or plates, e.g. bimetallic strip > Details of the compounds system

2 direct subcodes

Child Classifications

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  • G01K 5/66 Selection of composition of the components of the system
  • G01K 5/68 Shape of the system

Top Applicants

Top 10 applicants by patent filingsfor class G01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. CHINESE ACADEMY OF SCIENCES 21,460
  2. ROBERT BOSCH DE 17,801
  3. SGCC(STATE GRID CORPORATION OF CHINA) 17,347
  4. SAMSUNG ELECTRONICS COMPANY KR 13,192
  5. QUALCOMM US 9,900
  6. HALLIBURTON ENERGY SERVICES GROUP US 9,742
  7. PHILIPS ELECTRONICS NL 7,249
  8. MITSUBISHI ELECTRIC CORPORATION JP 6,503
  9. ZHEJIANG UNIVERSITY 6,414
  10. DENSO CORPORATION JP 6,382