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CPC Main Group
G01N 25/00

Investigating or analyzing materials by the use of thermal means (G01N3/00 - G01N23/00 take precedence)

9 direct subcodes

Child Classifications

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  • G01N 25/16 by investigating thermal coefficient of expansion
  • G01N 25/18 by investigating thermal conductivity (by calorimetry G01N25/20; by measuring change of resistance of an electrically-heated body G01N27/18)
  • G01N 25/72 Investigating presence of flaws

Top Applicants

Top 10 applicants by patent filingsfor class G01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. CHINESE ACADEMY OF SCIENCES 21,460
  2. ROBERT BOSCH DE 17,801
  3. SGCC(STATE GRID CORPORATION OF CHINA) 17,347
  4. SAMSUNG ELECTRONICS COMPANY KR 13,192
  5. QUALCOMM US 9,900
  6. HALLIBURTON ENERGY SERVICES GROUP US 9,742
  7. PHILIPS ELECTRONICS NL 7,249
  8. MITSUBISHI ELECTRIC CORPORATION JP 6,503
  9. ZHEJIANG UNIVERSITY 6,414
  10. DENSO CORPORATION JP 6,382