CPC Subgroup Additional Only
G05B 2219/49021 Deposit layer, machine, mill layer, then new layer, SDM solid deposit manufacting
Full Title
Program-control systems > Nc systems > Nc machine tool, till multiple > Deposit layer, machine, mill layer, then new layer, SDM solid deposit manufacting
Top Applicants
Top 10 applicants by patent filingsfor class G05, 2013–2023, worldwide · Source: EPO PATSTAT
- FANUC JP 6,367
- SIEMENS DE 5,963
- FANUC 4,535
- MITSUBISHI ELECTRIC CORPORATION JP 4,201
- ROBERT BOSCH DE 4,010
- LG ELECTRONICS KR 3,802
- SAMSUNG ELECTRONICS COMPANY KR 3,143
- FORD GLOBAL TECHNOLOGIES US 2,889
- TOYOTA MOTOR CORPORATION 2,778
- OMRON CORPORATION JP 2,743