CPC Subgroup Additional Only
G06F 2200/20 Indexing scheme relating to G06F1/20
Full Title
Indexing scheme relating to G06F1/04 - G06F1/32 > Indexing scheme relating to G06F1/20
3 direct subcodes
Child Classifications
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- G06F 2200/201 Cooling arrangements using cooling fluid
- G06F 2200/202 Air convective hinge
- G06F 2200/203 Heat conductive hinge
Top Applicants
Top 10 applicants by patent filingsfor class G06, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 76,952
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 62,841
- MICROSOFT TECHNOLOGY LICENSING US 44,778
- GOOGLE US 35,735
- INTEL CORPORATION US 32,087
- HUAWEI TECHNOLOGIES COMPANY CN 30,572
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY 25,023
- APPLE US 23,482
- SGCC(STATE GRID CORPORATION OF CHINA) 22,548
- HUAWEI TECHNOLOGIES COMPANY 20,917