G10H 2220/555 Bimorph transducers, i.e. piezoelectric bending multilayer structures with one or more piezoelectric layers, e.g. piezo on metal, serial bimorph or parallel bimorph
Full Title
Input/output interfacing specifically adapted for electrophonic musical tools or instruments > Transducers, i.e. details, positioning or use of assemblies to detect and convert mechanical vibrations or mechanical strains into an electrical signal, e.g. audio, trigger or control signal > Piezoelectric transducers for vibration sensing or vibration excitation in the audio range; Piezoelectric strain sensing, e.g. as key velocity sensor; Piezoelectric actuators, e.g. key actuation in response to a control voltage > Bimorph transducers, i.e. piezoelectric bending multilayer structures with one or more piezoelectric layers, e.g. piezo on metal, serial bimorph or parallel bimorph
Filing statistics
CPC G10H 2220/555 belongs to the parent subclass G10H, which recorded 17,124 patent applications worldwide between 2013 and 2023. Annual filings grew from 1,186 in 2013 to 1,533 in 2023 (+29%), peaking at 1,888 applications in 2020. The most active applicants in class G10 are SAMSUNG ELECTRONICS COMPANY (6,277 applications), GOOGLE (5,429 applications) and FRAUNHOFER (4,984 applications).
Source: EPO PATSTAT, worldwide filings
Top Applicants
Top 10 applicants by patent filingsfor class G10, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 6,277
- GOOGLE US 5,429
- FRAUNHOFER DE 4,984
- SONY CORPORATION JP 2,808
- HUAWEI TECHNOLOGIES COMPANY CN 2,577
- MICROSOFT TECHNOLOGY LICENSING US 2,382
- DOLBY LABORATORIES LICENSING CORPORATION US 2,123
- QUALCOMM US 2,117
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,049
- AMAZON TECHNOLOGIES US 1,924