G10H 2220/555 Bimorph transducers, i.e. piezoelectric bending multilayer structures with one or more piezoelectric layers, e.g. piezo on metal, serial bimorph or parallel bimorph
Full Title
Input/output interfacing specifically adapted for electrophonic musical tools or instruments > Transducers, i.e. details, positioning or use of assemblies to detect and convert mechanical vibrations or mechanical strains into an electrical signal, e.g. audio, trigger or control signal > Piezoelectric transducers for vibration sensing or vibration excitation in the audio range; Piezoelectric strain sensing, e.g. as key velocity sensor; Piezoelectric actuators, e.g. key actuation in response to a control voltage > Bimorph transducers, i.e. piezoelectric bending multilayer structures with one or more piezoelectric layers, e.g. piezo on metal, serial bimorph or parallel bimorph
Top Applicants
Top 10 applicants by patent filingsfor class G10, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 6,277
- GOOGLE US 5,429
- FRAUNHOFER DE 4,984
- SONY CORPORATION JP 2,808
- HUAWEI TECHNOLOGIES COMPANY CN 2,577
- MICROSOFT TECHNOLOGY LICENSING US 2,382
- DOLBY LABORATORIES LICENSING CORPORATION US 2,123
- QUALCOMM US 2,117
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,049
- AMAZON TECHNOLOGIES US 1,924