CPC Subgroup
G11B 3/08503 Full Title
Recording by mechanical cutting, deforming or pressing, e.g. of grooves or pits; Reproducing by mechanical sensing; Record carriers therefor (G11B11/00, take precedence) > Arrangements of heads > Raising, lowering, traversing otherwise than for transducing, arresting, or holding-up heads against record carriers > using automatic means (G11B3/095 takes precedence )
3 direct subcodes
Child Classifications
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Top Applicants
Top 10 applicants by patent filingsfor class G11, 2013–2023, worldwide · Source: EPO PATSTAT
- MICRON TECHNOLOGY US 12,397
- SAMSUNG ELECTRONICS COMPANY KR 12,238
- SK HYNIX KR 11,371
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
- INTEL CORPORATION US 3,874
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
- SANDISK TECHNOLOGIES US 3,151
- SK HYNIX 3,143
- SAMSUNG ELECTRONICS COMPANY 3,073
- WESTERN DIGITAL TECHNOLOGIES US 2,961