G11C 2207/10 Aspects relating to interfaces of memory device to external buses
Full Title
Indexing scheme relating to arrangements for writing information into, or reading information out from, a digital store > Aspects relating to interfaces of memory device to external buses
Filing statistics
CPC G11C 2207/10 belongs to the parent subclass G11C, which recorded 152,594 patent applications worldwide between 2013 and 2023. Annual filings grew from 10,826 in 2013 to 13,151 in 2023 (+21%), peaking at 17,166 applications in 2021. The most active applicants in class G11 are MICRON TECHNOLOGY (12,397 applications), SAMSUNG ELECTRONICS COMPANY (12,238 applications) and SK HYNIX (11,371 applications).
Source: EPO PATSTAT, worldwide filings
6 direct subcodes
Child Classifications
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- G11C 2207/101 Analog or multilevel bus
- G11C 2207/102 Compression or decompression of data before storage
- G11C 2207/104 Embedded memory devices, e.g. memories with a processing device on the same die or ASIC memory designs
- G11C 2207/105 Aspects related to pads, pins or terminals
- G11C 2207/107 Serial-parallel conversion of data or prefetch
- G11C 2207/108 Wide data ports
Top Applicants
Top 10 applicants by patent filingsfor class G11, 2013–2023, worldwide · Source: EPO PATSTAT
- MICRON TECHNOLOGY US 12,397
- SAMSUNG ELECTRONICS COMPANY KR 12,238
- SK HYNIX KR 11,371
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
- INTEL CORPORATION US 3,874
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
- SANDISK TECHNOLOGIES US 3,151
- SK HYNIX 3,143
- SAMSUNG ELECTRONICS COMPANY 3,073
- WESTERN DIGITAL TECHNOLOGIES US 2,961