CPC Main Group
H01B 13/00 Apparatus or processes specially adapted for manufacturing conductors or cables
Filing statistics
CPC H01B 13/00 belongs to the parent subclass H01B, which recorded 140,018 patent applications worldwide between 2013 and 2023. Annual filings grew from 10,354 in 2013 to 11,276 in 2023 (+9%), peaking at 15,902 applications in 2016. The most active applicants in class H01 are SAMSUNG ELECTRONICS COMPANY (37,897 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (36,116 applications) and APPLIED MATERIALS (21,640 applications).
Source: EPO PATSTAT, worldwide filings
21 direct subcodes
Child Classifications
Navigate with arrow keys, Enter to open
- H01B 13/004 for manufacturing rigid-tube cables
- H01B 13/008 for manufacturing extensible conductors or cables
- H01B 13/012 for manufacturing wire harnesses
- H01B 13/016 for manufacturing co-axial cables (applying discontinuous insulation H01B13/20)
- H01B 13/02 Stranding-up
- H01B 13/06 Insulating conductors or cables (H01B13/32 takes precedence)
- H01B 13/22 Sheathing; Armouring; Screening; Applying other protective layers (H01B13/32 takes precedence)
- H01B 13/28 Applying continuous inductive loading, e.g. Krarup loading
- H01B 13/30 Drying; Impregnating (H01B13/32 takes precedence)
- H01B 13/32 Filling or coating with impervious material
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080