CPC Main Group
H01B 13/00 Apparatus or processes specially adapted for manufacturing conductors or cables
21 direct subcodes
Child Classifications
Navigate with arrow keys, Enter to open
- H01B 13/004 for manufacturing rigid-tube cables
- H01B 13/008 for manufacturing extensible conductors or cables
- H01B 13/012 for manufacturing wire harnesses
- H01B 13/016 for manufacturing co-axial cables (applying discontinuous insulation H01B13/20)
- H01B 13/02 Stranding-up
- H01B 13/06 Insulating conductors or cables (H01B13/32 takes precedence)
- H01B 13/22 Sheathing; Armouring; Screening; Applying other protective layers (H01B13/32 takes precedence)
- H01B 13/28 Applying continuous inductive loading, e.g. Krarup loading
- H01B 13/30 Drying; Impregnating (H01B13/32 takes precedence)
- H01B 13/32 Filling or coating with impervious material
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080