CPC Main Group
H01B 5/00 Non-insulated conductors or conductive bodies characterised by their form
8 direct subcodes
Child Classifications
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- H01B 5/02 Single bars, rods, wires, or strips
- H01B 5/06 Single tubes
- H01B 5/08 Several wires or the like stranded in the form of a rope
- H01B 5/12 Braided wires or the like
- H01B 5/14 comprising conductive layers or films on insulating-supports
- H01B 5/16 comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber (H01B1/14, H01B1/20 take precedence; insulating bodies with conductive admixtures H01B17/64; conductive paints C09D5/24)
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080