CPC Subgroup
H01C 17/07 by resistor foil bonding, e.g. cladding
Full Title
Apparatus or processes specially adapted for manufacturing resistors (providing fillings for housings or enclosures H01C1/02; reducing insulation surrounding a resistor to powder H01C1/03; manufacture of thermally variable resistors H01C7/02, H01C7/04) > adapted for coating resistive material on a base > by resistor foil bonding, e.g. cladding