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PCE
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DIFF Subgroup
H01C 17/07

by resistor foil bonding, e.g. cladding

Introduced: January 1995

Full Title

Full titles differ between systems:

IPC:

Apparatus or processes specially adapted for manufacturing resistors > adapted for coating resistive material on a base > by resistor foil bonding, e.g. cladding

CPC:

Apparatus or processes specially adapted for manufacturing resistors (providing fillings for housings or enclosures H01C1/02; reducing insulation surrounding a resistor to powder H01C1/03; manufacture of thermally variable resistors H01C7/02, H01C7/04) > adapted for coating resistive material on a base > by resistor foil bonding, e.g. cladding

No child classifications to compare. This is a leaf node in both IPC and CPC.