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CPC Subgroup
H01C 3/14

the resistive element being formed in two or more coils or loops continuously wound as a spiral, helical or toroidal winding (H01C3/02 - H01C3/12 take precedence)

Full Title

Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids > the resistive element being formed in two or more coils or loops continuously wound as a spiral, helical or toroidal winding (H01C3/02 - H01C3/12 take precedence)

Filing statistics

CPC H01C 3/14 belongs to the parent subclass H01C, which recorded 15,389 patent applications worldwide between 2013 and 2023. Annual filings grew from 1,147 in 2013 to 1,264 in 2023 (+10%), peaking at 1,745 applications in 2018. The most active applicants in class H01 are SAMSUNG ELECTRONICS COMPANY (37,897 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (36,116 applications) and APPLIED MATERIALS (21,640 applications).

Source: EPO PATSTAT, worldwide filings

3 direct subcodes

Child Classifications

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  • H01C 3/16 including two or more distinct wound elements or two or more winding patterns
  • H01C 3/18 wound on a flat or ribbon base (H01C3/16 takes precedence)
  • H01C 3/20 wound on cylindrical or prismatic base (H01C3/16 takes precedence)

Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080