CPC Main Group
H01G 11/00 Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
Filing statistics
CPC H01G 11/00 belongs to the parent subclass H01G, which recorded 84,475 patent applications worldwide between 2013 and 2023. Annual filings grew from 6,481 in 2013 to 7,606 in 2023 (+17%), peaking at 8,803 applications in 2018. The most active applicants in class H01 are SAMSUNG ELECTRONICS COMPANY (37,897 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (36,116 applications) and APPLIED MATERIALS (21,640 applications).
Source: EPO PATSTAT, worldwide filings
12 direct subcodes
Child Classifications
Navigate with arrow keys, Enter to open
- H01G 11/02 using combined reduction-oxidation reactions, e.g. redox arrangement or solion
- H01G 11/04 Hybrid capacitors
- H01G 11/08 Structural combinations, e.g. assembly or connection, of hybrid or EDL capacitors with other electric components, at least one hybrid or EDL capacitor being the main component
- H01G 11/10 Multiple hybrid or EDL capacitors, e.g. arrays or modules (housings, cases, encapsulations or mountings thereof H01G11/78)
- H01G 11/14 Arrangements or processes for adjusting or protecting hybrid or EDL capacitors (emergency protective circuit arrangements specially adapted for capacitors, and effecting automatic switching in the event of an undesired change from normal working conditions H02H7/16; emergency protective circuit arrangements for limiting excess current or voltages without disconnection H02H9/00)
- H01G 11/22 Electrodes
- H01G 11/52 Separators
- H01G 11/54 Electrolytes
- H01G 11/66 Current collectors
- H01G 11/74 Terminals, e.g. extensions of current collectors
- H01G 11/78 Cases; Housings; Encapsulations; Mountings
- H01G 11/84 Processes for the manufacture of hybrid or EDL capacitors, or components thereof
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080