Structural combinations of capacitors or other devices covered by at least two different main groups of this subclass with each other (involving at least one hybrid or electric double-layer [EDL] capacitor as the main component H01G11/08)

Filing statistics

CPC H01G 15/00 belongs to the parent subclass H01G, which recorded 84,475 patent applications worldwide between 2013 and 2023. Annual filings grew from 6,481 in 2013 to 7,606 in 2023 (+17%), peaking at 8,803 applications in 2018. The most active applicants in class H01 are SAMSUNG ELECTRONICS COMPANY (37,897 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (36,116 applications) and APPLIED MATERIALS (21,640 applications).

Source: EPO PATSTAT, worldwide filings