CPC Subgroup
H01H 1/66 Contacts sealed in an evacuated or gas-filled envelope, e.g. magnetic dry-reed contacts
Full Title
Contacts (liquid contacts H01H29/04) > Protective enclosures, baffle plates, or screens for contacts > Contacts sealed in an evacuated or gas-filled envelope, e.g. magnetic dry-reed contacts
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080