CPC Main Group Additional Only
H01H 2203/00 Form of contacts
Filing statistics
CPC H01H 2203/00 belongs to the parent subclass H01H, which recorded 117,356 patent applications worldwide between 2013 and 2023. Annual filings grew from 8,912 in 2013 to 9,173 in 2023 (+3%), peaking at 12,388 applications in 2020. The most active applicants in class H01 are SAMSUNG ELECTRONICS COMPANY (37,897 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (36,116 applications) and APPLIED MATERIALS (21,640 applications).
Source: EPO PATSTAT, worldwide filings
18 direct subcodes
Child Classifications
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- H01H 2203/002 Raised edge
- H01H 2203/004 Rivet
- H01H 2203/006 Staples
- H01H 2203/008 Wires
- H01H 2203/012 Microprotrusions
- H01H 2203/016 universal; modular
- H01H 2203/018 binary coded
- H01H 2203/02 Interspersed fingers
- H01H 2203/022 Helical networks
- H01H 2203/024 Convex contact surface
- H01H 2203/026 on different planes
- H01H 2203/028 embedded in layer material
- H01H 2203/03 printed on casing
- H01H 2203/032 Metal foil
- H01H 2203/034 Common bus
- H01H 2203/036 to solve particular problems
- H01H 2203/056 Cuts or depressions in support, e.g. to isolate contacts
- H01H 2203/058 Contact area function of position on layered keyboard
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080