CPC Subgroup Additional Only
H01H 2233/01 mounted on laykey
Full Title
Key modules > mounted on laykey
7 direct subcodes
Child Classifications
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- H01H 2233/012 Locating pins
- H01H 2233/014 Snap coupling
- H01H 2233/018 One degree of freedom
- H01H 2233/02 captured between assembled parts of support
- H01H 2233/024 Riveting
- H01H 2233/026 Inserting
- H01H 2233/028 connected by spring
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080