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CPC Subgroup
H01H 61/02

wherein the thermally-sensitive member is heated indirectly, e.g. resistively, inductively

Full Title

Electrothermal relays (thermal switches not operated by electrical input, thermal switches with anticipating electrical input H01H37/00; thermally-sensitive members H01H37/32) > wherein the thermally-sensitive member is heated indirectly, e.g. resistively, inductively

Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080