CPC Subgroup
H01H 71/14 Electrothermal mechanisms
Full Title
Details of the protective switches or relays covered by groups H01H73/00 - H01H83/00 > Operating or release mechanisms > Automatic release mechanisms with or without manual release > Electrothermal mechanisms
7 direct subcodes
Child Classifications
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- H01H 71/16 with bimetal element
- H01H 71/18 with expanding rod, strip, or wire
- H01H 71/20 with fusible mass
- H01H 71/22 with compensation for variation of ambient temperature
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080