CPC Main Group
H01H 9/00 Details of switching devices, not covered by groups H01H1/00 - H01H7/00
20 direct subcodes
Child Classifications
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- H01H 9/02 Bases, casings, or covers (accommodating more than one switch or a switch and another electrical component H02B1/26)
- H01H 9/08 Arrangements to facilitate replacement of a switch, e.g. cartridge housing
- H01H 9/10 Adaptation for built-in fuses (mounting switch and fuse separately on, or in, common support H02B1/18)
- H01H 9/12 Means for earthing parts of switch not normally conductively connected to the contacts
- H01H 9/14 Adaptation for built-in safety spark gaps
- H01H 9/16 Indicators for switching condition, e.g. "on" or "off"
- H01H 9/18 Distinguishing marks on switches, e.g. for indicating switch location in the dark; Adaptation of switches to receive distinguishing marks
- H01H 9/20 Interlocking, locking, or latching mechanisms
- H01H 9/30 Means for extinguishing or preventing arc between current-carrying parts
- H01H 9/48 Means for preventing discharge to non-current-carrying parts, e.g. using corona ring
- H01H 9/50 Means for detecting the presence of an arc or discharge
- H01H 9/52 Cooling of switch parts (cooling of contacts H01H1/62)
- H01H 9/54 Circuit arrangements not adapted to a particular application of the switching device and for which no provision exists elsewhere
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080