Details

Full Title

Discharge tubes with liquid-pool cathodes, e.g. metal-vapour rectifying tubes > Details

Filing statistics

CPC H01J 13/02 belongs to the parent subclass H01J, which recorded 135,587 patent applications worldwide between 2013 and 2023. Annual filings grew from 10,933 in 2013 to 11,751 in 2023 (+7%), peaking at 14,583 applications in 2021. The most active applicants in class H01 are SAMSUNG ELECTRONICS COMPANY (37,897 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (36,116 applications) and APPLIED MATERIALS (21,640 applications).

Source: EPO PATSTAT, worldwide filings

11 direct subcodes

Child Classifications

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H01J 13/04 Main electrodes; Auxiliary anodes
H01J 13/20 Control electrodes, e.g. grid (for igniting arrangements H01J13/34)
H01J 13/22 Screens, e.g. for preventing or eliminating arcing-back
H01J 13/24 Vessels; Containers
H01J 13/26 Seals between parts of vessels; Seals for leading-in conductors; Leading-in conductors
H01J 13/28 Selection of substances for gas filling; Means for obtaining the desired pressure within the tube
H01J 13/32 Cooling arrangements; Heating arrangements (for cathodes H01J13/14; for anodes H01J13/18)
H01J 13/34 Igniting arrangements
H01J 13/44 Devices for preventing or eliminating arcing-back
H01J 13/46 One or more circuit elements structurally associated with the tube
H01J 13/48 Circuit arrangements not adapted to a particular application of the tube and not otherwise provided for

Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG ELECTRONICS COMPANY KR 37,897
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
APPLIED MATERIALS US 21,640
LG ENERGY SOLUTION KR 20,770
LG CHEM KR 19,835
TOKYO ELECTRON JP 18,519
ROBERT BOSCH DE 14,595
INTEL CORPORATION US 13,580
MURATA MANUFACTURING COMPANY JP 12,151
SAMSUNG SDI COMPANY KR 12,080