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CPC Subgroup Additional Only
H01J 2209/463

Identifying or selecting component pieces

Full Title

Apparatus and processes for manufacture of discharge tubes > Handling of tube components during manufacture > Identifying or selecting component pieces

Filing statistics

CPC H01J 2209/463 belongs to the parent subclass H01J, which recorded 135,587 patent applications worldwide between 2013 and 2023. Annual filings grew from 10,933 in 2013 to 11,751 in 2023 (+7%), peaking at 14,583 applications in 2021. The most active applicants in class H01 are SAMSUNG ELECTRONICS COMPANY (37,897 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (36,116 applications) and APPLIED MATERIALS (21,640 applications).

Source: EPO PATSTAT, worldwide filings

1 direct subcode

Child Classifications

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Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080