Constructional details

Full Title

Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs > Constructional details

Filing statistics

CPC H01J 2211/20 belongs to the parent subclass H01J, which recorded 135,587 patent applications worldwide between 2013 and 2023. Annual filings grew from 10,933 in 2013 to 11,751 in 2023 (+7%), peaking at 14,583 applications in 2021. The most active applicants in class H01 are SAMSUNG ELECTRONICS COMPANY (37,897 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (36,116 applications) and APPLIED MATERIALS (21,640 applications).

Source: EPO PATSTAT, worldwide filings

9 direct subcodes

Child Classifications

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H01J 2211/22 Electrodes
H01J 2211/34 Vessels, containers or parts thereof, e.g. substrates
H01J 2211/46 Connecting or feeding means, e.g. leading-in conductors
H01J 2211/48 Sealing, e.g. seals specially adapted for leading-in conductors
H01J 2211/50 Filling, e.g. selection of gas mixture
H01J 2211/52 Means for absorbing or adsorbing the gas mixture, e.g. by gettering
H01J 2211/54 Means for exhausting the gas
H01J 2211/62 Circuit arrangements
H01J 2211/66 Cooling arrangements

Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG ELECTRONICS COMPANY KR 37,897
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
APPLIED MATERIALS US 21,640
LG ENERGY SOLUTION KR 20,770
LG CHEM KR 19,835
TOKYO ELECTRON JP 18,519
ROBERT BOSCH DE 14,595
INTEL CORPORATION US 13,580
MURATA MANUFACTURING COMPANY JP 12,151
SAMSUNG SDI COMPANY KR 12,080