CPC Main Group
H01K 1/00 Details
13 direct subcodes
Child Classifications
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- H01K 1/02 Incandescent bodies
- H01K 1/18 Mountings or supports for the incandescent body
- H01K 1/26 Screens; Filters (associated with envelope H01K1/28)
- H01K 1/28 Envelopes; Vessels
- H01K 1/36 Seals between parts of vessel, e.g. between stem and envelope
- H01K 1/38 Seals for leading-in conductors
- H01K 1/40 Leading-in conductors
- H01K 1/42 Means forming part of the lamp for the purpose of providing electrical connection, or support for, the lamp
- H01K 1/50 Selection of substances for gas fillings; Specified pressure thereof
- H01K 1/52 Means for obtaining or maintaining the desired pressure within the vessel
- H01K 1/58 Cooling arrangements
- H01K 1/60 Means structurally associated with the lamp for indicating defects or previous use
- H01K 1/62 One or more circuit elements structurally associated with the lamp
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080