CPC Subgroup
H01M 10/65 Means for temperature control structurally associated with the cells
Full Title
Secondary cells; Manufacture thereof > Heating or cooling; Temperature control > Means for temperature control structurally associated with the cells
9 direct subcodes
Child Classifications
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- H01M 10/651 characterised by parameters specified by a numeric value or mathematical formula, e.g. ratios, sizes or concentrations
- H01M 10/653 characterised by electrically insulating or thermally conductive materials
- H01M 10/654 located inside the innermost case of the cells, e.g. mandrels, electrodes or electrolytes
- H01M 10/655 Solid structures for heat exchange or heat conduction
- H01M 10/656 characterised by the type of heat-exchange fluid
- H01M 10/657 by electric or electromagnetic means
- H01M 10/658 by thermal insulation or shielding
- H01M 10/659 by heat storage or buffering, e.g. heat capacity or liquid-solid phase changes or transition
- H01M 10/6595 by chemical reactions other than electrochemical reactions of the cells, e.g. catalytic heaters or burners
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080